BYG90-90 Schottky Barrier Rectifier Diode Technical Summary

BYG90-90 Schottky Barrier Rectifier Diode

Overview

The BYG90-90 is a high-performance Schottky barrier rectifier diode designed for applications requiring low switching losses and high efficiency. Fabricated using advanced planar technology, this component is encapsulated in a compact SOD106A plastic surface-mount device (SMD) package, making it suitable for modern PCB designs where space is at a premium. The diode is optimized for high-frequency switching applications, offering superior performance compared to conventional PN junction diodes.

With its Schottky barrier construction, the BYG90-90 exhibits minimal reverse recovery time, enabling faster switching speeds and reduced power losses. This makes it particularly well-suited for power supply circuits, voltage clamping, and freewheeling applications in both industrial and consumer electronics.

Key Features

Low switching losses: Optimized for high-frequency operation with minimal power dissipation
High breakdown voltage: Robust performance in demanding electrical environments
High surge current capability: Can absorb very high transient currents without damage
Low forward voltage drop: Typically 0.55V at 5A, improving system efficiency
Planar technology: Provides consistent performance and reliability
SMD package (SOD106A): Space-saving design for modern PCB layouts
Lead-free and RoHS compliant: Meets environmental regulations
Excellent thermal characteristics: Low thermal resistance for improved power handling

Applications

The BYG90-90's combination of high-speed switching and power handling characteristics makes it ideal for a wide range of applications:

Power Conversion Systems

Switch-mode power supplies (SMPS)
DC-DC converters
AC-DC rectification circuits
Voltage multiplier circuits

Industrial Electronics

Motor drive circuits
Inverter systems
Power factor correction circuits
Industrial automation equipment

Consumer Electronics

LCD/LED television power supplies
Computer power systems
Gaming consoles
Battery charging circuits

Automotive Systems

Alternator rectification
Electronic control units (ECUs)
LED lighting systems
Electric vehicle power systems

Electrical Characteristics

The following tables detail the key electrical parameters of the BYG90-90 Schottky diode:

Absolute Maximum Ratings

Maximum repetitive peak reverse voltage (VRRM): 90V
Maximum RMS voltage (VRMS): 63V
Maximum DC blocking voltage (VDC): 90V
Maximum average forward current (IF(AV)): 5A
Peak forward surge current (IFSM): 150A (8.3ms single half-sine-wave)
Operating junction temperature range (TJ): -65°C to +150°C
Storage temperature range (TSTG): -65°C to +150°C

Thermal Characteristics

Junction-to-ambient thermal resistance (RθJA): 50°C/W
Junction-to-lead thermal resistance (RθJL): 25°C/W

Forward Characteristics (at TJ = 25°C unless otherwise specified)

Forward voltage (VF): 0.55V typical, 0.75V maximum at IF = 5A
Forward voltage temperature coefficient: -1.5mV/°C

Reverse Characteristics

Reverse leakage current (IR): 0.5mA maximum at VR = 90V, TJ = 25°C
Reverse leakage current (IR): 10mA maximum at VR = 90V, TJ = 125°C
Typical junction capacitance (CJ): 150pF at VR = 10V, f = 1MHz

Switching Characteristics

Reverse recovery time (trr): Typically less than 20ns
Recovery charge (Qrr): Typically 30nC

Package Information

The BYG90-90 is housed in a SOD106A plastic SMD package, which offers excellent thermal and electrical performance in a compact form factor.

Package Dimensions

Package type: SOD106A (DO-214AC)
Length: 4.3mm ± 0.2mm
Width: 2.6mm ± 0.2mm
Height: 1.6mm ± 0.1mm
Lead width: 0.8mm ± 0.1mm
Lead thickness: 0.5mm ± 0.1mm

Package Marking

The device is marked with the following identification:

Top side: "BYG90"
Cathode indicator: Band on one end of package

Recommended PCB Land Pattern

For optimal performance and reliability, the following PCB land pattern is recommended:

Pad width: 1.0mm
Pad length: 2.0mm
Pad spacing: 2.4mm (center-to-center)
Solder paste coverage: 80% of pad area recommended

Handling and Soldering

The BYG90-90 is compatible with standard SMD assembly processes:

Reflow soldering: Compatible with lead-free (260°C peak) and leaded (240°C peak) profiles
Wave soldering: Not recommended due to package size
Hand soldering: Use temperature-controlled iron with maximum tip temperature of 350°C for no more than 3 seconds
ESD protection: Standard ESD precautions should be observed during handling